JPH0510380Y2 - - Google Patents
Info
- Publication number
- JPH0510380Y2 JPH0510380Y2 JP1799988U JP1799988U JPH0510380Y2 JP H0510380 Y2 JPH0510380 Y2 JP H0510380Y2 JP 1799988 U JP1799988 U JP 1799988U JP 1799988 U JP1799988 U JP 1799988U JP H0510380 Y2 JPH0510380 Y2 JP H0510380Y2
- Authority
- JP
- Japan
- Prior art keywords
- film
- printed circuit
- back side
- circuit
- circuit pattern
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000000758 substrate Substances 0.000 claims description 16
- 238000001746 injection moulding Methods 0.000 description 9
- 238000004519 manufacturing process Methods 0.000 description 6
- 239000011347 resin Substances 0.000 description 6
- 229920005989 resin Polymers 0.000 description 6
- 239000004020 conductor Substances 0.000 description 5
- 238000002347 injection Methods 0.000 description 4
- 239000007924 injection Substances 0.000 description 4
- 238000000465 moulding Methods 0.000 description 4
- 239000010410 layer Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 239000004033 plastic Substances 0.000 description 2
- 229920003023 plastic Polymers 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 238000007740 vapor deposition Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229920006269 PPS film Polymers 0.000 description 1
- 229920000122 acrylonitrile butadiene styrene Polymers 0.000 description 1
- 239000004676 acrylonitrile butadiene styrene Substances 0.000 description 1
- 239000012790 adhesive layer Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 229920003229 poly(methyl methacrylate) Polymers 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 239000004926 polymethyl methacrylate Substances 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
Landscapes
- Structure Of Printed Boards (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1799988U JPH0510380Y2 (en]) | 1988-02-12 | 1988-02-12 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1799988U JPH0510380Y2 (en]) | 1988-02-12 | 1988-02-12 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH01121966U JPH01121966U (en]) | 1989-08-18 |
| JPH0510380Y2 true JPH0510380Y2 (en]) | 1993-03-15 |
Family
ID=31232253
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1799988U Expired - Lifetime JPH0510380Y2 (en]) | 1988-02-12 | 1988-02-12 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0510380Y2 (en]) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6251656B2 (ja) * | 2014-09-04 | 2017-12-20 | 日本発條株式会社 | ディスク装置用フレキシャの配線部のインターリーブ回路 |
-
1988
- 1988-02-12 JP JP1799988U patent/JPH0510380Y2/ja not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH01121966U (en]) | 1989-08-18 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| EP0485838B1 (de) | Spritzgegossene Leiterplatten durch Hinterspritzen von flexiblen Schaltungen mit thermoplastischen Materialien | |
| JPH0696357B2 (ja) | Ｉｃカードの製造方法 | |
| US5979043A (en) | Method of manufacturing a circuit assembly from two or more layers of flexible film | |
| EP0896787B1 (en) | A multi-layer moulded electronic device and method for manufacturing same | |
| JPH0510380Y2 (en]) | ||
| EP0614328B1 (en) | Composite molded product having three-dimensional multi-layered conductive circuits and method of its manufacture | |
| JP3607416B2 (ja) | プラスチック成形方法 | |
| JPH054836B2 (en]) | ||
| JPH0563111B2 (en]) | ||
| JPH0665756B2 (ja) | 部分メツキプラスチツク成形品及びその製法 | |
| JPH04309287A (ja) | 立体配線板の製造方法 | |
| JP2761981B2 (ja) | プリント回路基板の製法 | |
| JPH043772Y2 (en]) | ||
| JPH04341813A (ja) | プラスチック成形品 | |
| CN213321109U (zh) | 一种imr工艺双面装饰的模内注塑件 | |
| JPH037972Y2 (en]) | ||
| JP3388429B2 (ja) | 成形品内における部材の導電パターンへの金属板接続方法 | |
| JPS63200592A (ja) | 立体印刷回路成形体の製造方法 | |
| JP2726884B2 (ja) | 高密度配線板の製造方法 | |
| JPH0191444A (ja) | 多層プリント回路基板の射出成形方法 | |
| JPH04177790A (ja) | 電気回路構成部品及びその製造方法 | |
| JPH0435915B2 (en]) | ||
| JPH0821776B2 (ja) | 両面回路基板の製法 | |
| JPH0831668B2 (ja) | メツキプラスチツク成型品の成形法 | |
| JPS58184794A (ja) | 多層形水平プリント板およびその製造方法 |